In response to the development needs of high-power laser technology and driven by the demand for large national laser devices, a full process control technique for high damage threshold laser films and various quantitative technologies and devices for different process steps have been invented. A series of high damage threshold laser film devices have been produced and applied, enhancing the performance of such devices in China. At the same time, the 'key technologies for high damage threshold laser film devices' have been successfully transferred to enterprises, which jointly built a pilot production line for high damage threshold laser film devices. This will provide high-quality laser film optical components for major national needs and domestic and international laser markets. Key technologies include: 1. Proposing a new method for studying the defect damage mechanism in the substrate-film system, elucidating the physical mechanisms and quantitative laws of defect damage, and inventing a new quantitative approach for the entire process of manufacturing laser film devices; 2. Invented high-precision detection technology for subsurface micro-nano scale defects on substrates, as well as multiple iterative etching removal techniques and devices, to produce optical substrates with a subsurface defect layer <90nm; 3. Invented quantitative monitoring methods for substrate surface defects and multi-frequency composite ultrasonic quantitative cleaning technology and specialized equipment, which can reduce the density of defects on the cleaned substrate (50nm) surface by more than 300nm to less than 0.6 per square millimeter; 4. Invented film system design methods, thin film preparation technologies and components, as well as laser pretreatment technology to suppress the defect electric field enhancement effect, which has increased the device's damage threshold by more than 10 times.