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Adhesiveforcuttingandfixingphotovoltaicsiliconrodmaterials

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Registration number:G20250627

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Key words: silicon rod material adhesive

Green classification:

Publisher:管理人员

Release time:2025-08-09 08:56:54.0

  • Essential information
Name of achievement: Adhesiveforcuttingandfixingphotovoltaicsiliconrodmaterials
Result registration number: G20250627 Subject classification:
Green classification: Item keywords: silicon rod material  adhesive      
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Tongji University

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Mode of cooperation: Outcome Information:
Countries/regions: China Intellectual property rights:
Introduction: Click to view
Silicon rod cutting is a key part of the solar photovoltaic cell manufacturing process, which requires slicing multi-crystalline (monocrystalline) silicon rods into thin wafers. During the cutting process, a type of silicon rod cutting adhesive is needed to temporarily secure the rod and can be easily and quickly peeled off after the cutting is complete. As a necessary consumable in the solar industry, the domestic market for cutting adhesives is completely monopolized by foreign products, with high prices and supply constraints, while domestic companies have not yet launched similar products on the market. This project is based on the localization of such new energy technologies and vacuum technology, developing a new type of silicon rod cutting adhesive that solves the problem of localization of key consumables in the new energy solar industry, fills domestic technology gaps, and breaks the market monopoly of foreign large companies. The project team has also developed or is currently developing many adhesive and new material projects for advanced manufacturing industries such as new energy (solar and LED), automotive, electronics, etc. It has a strong strength in the industrialization development of new materials. The products of this project have a wide range of applications, and the most widely used at present is for cutting semiconductor silicon rods, serving as a fixing function during the cutting process. After the cutting is completed, it is easy to rinse off and peel off the glue. In addition, it can also be applied to the fixation during the grinding of semiconductor silicon wafers, the fixation during optical lens processing and cutting-grinding, and the precision cutting and grinding of hard and brittle materials such as glass and quartz.
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